Other Parts Discussed in Thread: LM393B
I have a really specific question regarding the DSBGA packaging for the LM393-N...
There is a customer considering this package, but they are nervous about the way these DSBGA packages have the epoxy/resin/etc coating on the "top", while the bottom (where the balls are) is basically just a "solder mask" (according to AN-1112 application report)
They have a strenuous pre-acceptance device packaging test (details via personal email), and are concerned about the robustness/reliability of this "thin solder mask" to hold up to the testing.
Is there any information/data that could be shared (even via email) regarding the strength/resilience characteristics of the thin "undercoating" of the package?
Regards,
Darren