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LM393-N: DSBGA Package Question

Part Number: LM393-N
Other Parts Discussed in Thread: LM393B

I have a really specific question regarding the DSBGA packaging for the LM393-N...

There is a customer considering this package, but they are nervous about the way these DSBGA packages have the epoxy/resin/etc coating on the "top", while the bottom (where the balls are) is basically just a "solder mask" (according to AN-1112 application report)

They have a strenuous pre-acceptance device packaging test (details via personal email), and are concerned about the robustness/reliability of this "thin solder mask" to hold up to the testing.

Is there any information/data that could be shared (even via email) regarding the strength/resilience characteristics of the thin "undercoating" of the package?



  • Darren

    I’ll see what information I can find tomorrow but did you show your customer the new leadless package option for lm393b? It’s a 2x2 wson package that’s sampling now. It sounds like that’s a better option for them with improved performance.


  • Hi Darren,

    The bottom of the die is covered in a thicker-than-normal polymer passivation -  it is not soft "solder-mask" as you would have on a PCB. So the bottom of the die is sealed as well as any packaged device.

    Is there a particular area of concern? When properly mounted, the bottom of the die should be physically protected by the PCB. I would be more concerned about the other SMT passives around the device. If moisture or the environment is a concern, then the entire assembly should be sealed with a conformal coating or paraffin to protect all components.

    See the Packaging Appnotes "DSBGA" section - but you already found the major appnote (AN-1112).

    I'll send you internal links to the packaging group contacts.