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OPA569: Junction-to-Case Thermal Resistance measurement spot

Anand Rajamani
Prodigy 30 points
Part Number: OPA569

Is the ThetaJC measured to the bottom or top of the IC package on the OPA569? It has a thermal pad and low thermal resistance of 0.37*C/W, so I wanted to make sure the location was correct for heatsink purposes.

  • 0
    TI__Guru* 93105 points

    Hello Anand,

    The OPA569 junction-to-case (θJC) thermal resistance which is typically 0.37 °C/W, is for the thermal path extending from near the internal die's top surface to the underside of the plastic package's bottom metal PowerPAD. That thermal path is responsible for conducting away the majority of the heat that will be generated by the OPA569 die.

    Even though OPA569 θJC is very low do be sure to take into account the OPA569 Safe Operating Area (SOA) information on datasheet pages 16 and 17.

    Regards, Thomas

    Precision Amplifiers Applications Engineering