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OPA211-HT: Gap space under HKQ case (OPA211SHKQ)

antonio papa
Prodigy 20 points
Part Number: OPA211-HT

We are using your 200 °C integrated components with HKQ case(OPA211SHKQ). These components have a space of 1 / 1.3mm in the part below in contact with the PCB.Does this space need to be filled with a resin to firmly fix the components? The PCB must be mounted in an oil well and must withstand high vibrations. Is it correct to do this type of assembly? The gold pad or lid does not need to be soldered to the board, but with the 1 / 1.3mm gap only soldered by the pins and locked with the thermal resin, is that correct? What do you recommend? We have already purchased components from Mouser. Attached photo of IC.

Thanks

Antonio

  • 0
    TI__Mastermind 47796 points

    Hi Antonio,

    There are two bonding options. 1. Use high temperature solder. 2 Use thermal conductive adhesives (if temperature is not high in the oil well, I would simply use epoxy to pot the Op Amp in place). 

    I would recommend the option 2, since it is easier to do and less thermal stress on the part. Since this is high vibration application, you will likely pot most leaded and/or larger mass of electronic components to PCB anyway, so that these parts will not snap off from the actual operating conditions or certification test.  

    if you are going to use high temperature solder, the caveat about maximum reflow temperature is very important.  The eutectic temperature of the AuSn lid solder-seal is 280°C and it starts to soften around 265°C to 270°C.

    For thermal adhesive it is best to check with Loctite/Henkel/Ablestik to find one that is compatible with their application.   See https://www.henkel-adhesives.com/us/en/industries/aerospace/electronics-for-aerospace.html as a landing page. For the high vibration application, I am certain that you have your own approved adhesives for the application. 

    If you have other questions,  please let us know. 

    Best,

    Raymond

  • 0 in reply to Raymond Zhang1
    Prodigy 20 points

    Hi Raymon,

    now we have all the information to proceed with assembly and testing.

    Thanks for the  support.

    Best,

    Antonio