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INA128: About the cause of failure

user6422847
Prodigy 140 points
Part Number: INA128
I'm sorry that time has passed since the last question.
We are currently requesting failure analysis in Japan.
It is a halfway process, but it is the result of X-ray.
Shadows that were thought to be wire peeling were observed at all terminals.
From now on, we will disassemble it further and check the inside.
After all, it is thought that the steam explosion inside the IC is caused by the moisture absorption of the package, but please give us your opinion.
  • 0 in reply to user6422847
    TI__Mastermind 47966 points

    Hi ,

    I am going to ask quality engineer to reply your questions. The engineer may be out of office today, I will ask him to reply when he is available. 

    Best,

    Raymond

  • 0 in reply to Raymond Zhang1
    TI__Prodigy 395 points

    Hello user6422847,

    The INA128 is an level-3-260C-168 product and must be bake per JEDEC standards. Additional information can be found using the following link. Document SPRABY1A.

    Based on the images all wires appears to be lifted which supports the possible 'popcorn' issues during customer reflow. If needed please forward the reflow profile for review by TI's subject matter experts.

    Regards,

    Joseph

  • 0 in reply to Joseph Serritella
    Prodigy 140 points

    Thank you for your reply.

    We will send you a reflow profile.

    Thank you.reflow profile.pdf

  • 0 in reply to user6422847
    TI__Mastermind 47966 points

    Hi ,

    We will reply back to you tomorrow. 

    If INA128s contain certain levels of moisture inside of molding compounds, the internal ICs will generate high internal steam pressure and "mini explosion",  when rapid heating rate exceeds 100C in the reflow process (the time that the part exceeds 100C is approx. 300 seconds).  

    Best,

    Raymond

  • 0 in reply to Raymond Zhang1
    TI__Mastermind 47966 points

    Hi ,

    Below are the comments that from our quality engineers regarding to INA128's reflow profile. 

    INA128 is in SO package. It is rated MSL3-260C.

    If the package floor life expired, they should be baked per JEDEC procedure, otherwise, the moisture absorbed by the package (mainly mold compound) will cause pop-corn and/or delamination.

    Below is my comment on the attached profile based on the plot and numbers.

    The pre-heat soaking 74-76 sec was at the low end. (JEDEC 60-120 sec). Reflow >217C around 60 sec. is too low (JEDEC 60-150 sec). Peak Temp 240C is fine. Time within 5C to peak estimated slightly less than 30 sec (JEDEC minimum 30 sec). Overall, pre-heat and Total time above 217C can be extended.  

    If you have additional questions, please let us know.

    Best,

    Raymond

  • 0 in reply to Raymond Zhang1
    Prodigy 140 points

    Thank you for your reply.

    We will send you the results of the disassembly survey in the IC.

    Normally, disconnection due to thermal stress is often confirmed as disconnection directly above, but this time it is observed as joint peeling (peeling of the alloy layer part).

    Does this happen if the bond strength is reduced due to the moisture absorption of the IC package?

    INA128UAE4故障解析（内部）.pdf

  • 0 in reply to user6422847
    TI__Prodigy 395 points

    Hello,

    based on the images the majority bond wires are lifted, coupled with the x-ray images we observed them same which is indication of moisture ingress followed by a reflow process during PCB assembly. TI failure analysis experts observe ball bond lifting due to popcorn effect. The best method to analysis this is through CSAM (Acoustic microcopy) and not top side decap. The INA128UA has shipped in high volume since release and no process anomalies were observed on recent assembly batches. Please note, the INA128 is an MSL level 3 product and adhere to JEDEC standards is imperative.

    If additional support is required please make a submission to TI.com/Returns