Other Parts Discussed in Thread: LF156, LM741
We are using LM111, LM101,LF156 and LM741 DIEs in one of our project.
We are facing issues as explained below
1. All DIEs attached to alumina substrate and 1 MIL gold wire-bonded
2. Baking of unit(TI DIEs assembled) at 160-170degree Celsius for 24 Hours.
3. Stabilize bake @75 degree Celsius for 48 Hours
4. Thermal Cycling for all units of 30Min +85degree Celsius and 30Min -55degree Celsius like
this 10 cycles.
We are observing the repetitive failure of DIEs after completing the above mentioned ESS steps.
Please advice the reason for the DIEs failure.