Hi,
I would like clarification on the bare die dimensions figure on page 4 of the datasheet. What does the 38 µm extending from the die dimensions? Is this the scribe length?
Also, in table 2 what does A,B,C and D indicate? Is this in µm from the edge of of the die after scribe and A = x min, B = y min, C = x max and D = y max of the pad?
Thanks,
David
Hello,
the 38µm typically refers to the edge of the die, across the ground ring to the active area of the die.
The alphabetic characters refer to directions from an edge of the die to the edge of the bond pad. For example, A represents the distance from the die edge to the left side of each bond pad, notice how the A distance for bond pads 1,2,3 and 4 are approximately equal.
Regards,
Joseph
Hi Joseph,
A few more questions. Does the "edge of die" you refer to the edge indicated by the red arrow in the below figure and point (0,0) is the bottom-left of the inner rectangle.
Thanks,
David
Hi David,
Based on my current review the numbers provided in the table to not include the distance highlighted by the "red arrow". For example, the distance to pad 1 side A is approximately 21.20um. If it included the distance defined by the "red arrow" it would need to be greater than 38um.
Best Regards,
Joseph
