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THS3062: with power pad exhibiting overheating and shortened lifespan

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Replies: 14

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Part Number: THS3062

The third question is in addition to the first two I already posted regarding the same subject.

1, Could solder voids (on the power pad) cause overheating and shortened lifespan? Is there a specification for the maximum void on the power pad where overheating could lead to shortened lifespan?

2. If the power pad design did not include the recommended five, 10 mil diameter vias, (I.E. If only one or two via's went through the power pad to ground plane or other), could this cause overheating and shortened lifespan? 

3. Additional question: We have been measuring the external package temperature. The nominal value for the package temperature that we have deemed acceptable is 65C. Is this acceptable?