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TMP513: What is the purpose for the keep out Area near pin 1

Matthew N
Intellectual 1740 points
Part Number: TMP513

The RSA package Land Pattern Data in the datasheet indicates that there is a Route Keep Out Area by Pin 1.  Can you clarify what the purpose of this is for and if it applies to the TMP513? 

I did see a reference in SLUA271A for possible keep out areas near pin one for QFN's due to exposed metal pin 1 feature, but couldn't find such a feature described in the TMP513 datasheet.  Can you help clarify if the keep out is necessary?

slua271a.pdf

Best regards,
Matt

I

  • 0
    TI__Expert 6475 points
    The app report document on the QFN's keep-out area is still valid for TMP513 QFN package. The keep-out note is package specific.
    The purpose is stated in the app report:

    "This ensures sufficient solder mask in the corner of the PCB footprint design and also
    prevents the metal feature from encroaching beyond an air gap of 0,2 mm. In addition, it has been
    observed that some QFN configurations utilize an exposed metal pin 1 feature beneath the component,
    which has a potential of shorting to a via if present in this region."