This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

  • TI Thinks Resolved

ONET2804T: Decoupling Capacitors

Prodigy 60 points

Replies: 1

Views: 331

Part Number: ONET2804T

The datasheet for the ONET2804T recommends 2 single layer caps between 270pF and 680pF to be bonded to the VCCI pads.  If the ONET2804T will be mounted direct to the laminate and not to a ceramic substrate, can the VCCI connections be bonded to a pad on the laminate and MLCCs placed on the PCB for decoupling?  The caps would be placed adjacent to the bonding pads.

  • Hi Robert,

    The single layer caps typically have very high SRFs in the range of 30-40GHz that is ideal for supply decoupling of the ONET2804T whose f-3dB BW is 21GHz. I am not sure whether that's the case with MLCCs whose parasitic inductance might compromise the ONET2804T performance in terms of DJ. Also, I would recommend that the ONET2804T be placed on a ceramic substrate where-in the device sees a solid ground with less inductance compared to a laminate. So, I think the recommendation would be to stay as close to what is mentioned in the ONET2804T datasheet in-terms of power supply decoupling and mounting on a ceramic substrate.

    Best Regards,

    Rohit

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.