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Part Number: ONET2804T
The datasheet for the ONET2804T recommends 2 single layer caps between 270pF and 680pF to be bonded to the VCCI pads. If the ONET2804T will be mounted direct to the laminate and not to a ceramic substrate, can the VCCI connections be bonded to a pad on the laminate and MLCCs placed on the PCB for decoupling? The caps would be placed adjacent to the bonding pads.
The single layer caps typically have very high SRFs in the range of 30-40GHz that is ideal for supply decoupling of the ONET2804T whose f-3dB BW is 21GHz. I am not sure whether that's the case with MLCCs whose parasitic inductance might compromise the ONET2804T performance in terms of DJ. Also, I would recommend that the ONET2804T be placed on a ceramic substrate where-in the device sees a solid ground with less inductance compared to a laminate. So, I think the recommendation would be to stay as close to what is mentioned in the ONET2804T datasheet in-terms of power supply decoupling and mounting on a ceramic substrate.
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