The data sheet does not have a thermal resistance from junction to Case or junction to board.
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The data sheet does not have a thermal resistance from junction to Case or junction to board.
Hi Sam,
Please find below the thermal data that you've requested.
Thermal Metric |
TLE2072 |
UNIT |
D (SOIC) |
||
8 PINS |
||
RθJA Junction-to-ambient thermal resistance |
110.6 |
°C/W |
RθJC(top) Junction-to-case(top) thermal resistance |
50.8 |
°C/W |
RθJB Junction-to-board thermal resistance |
54.1 |
°C/W |
ψJT Junction-to-top characterization parameter |
8.7 |
°C/W |
ψJB Junction-to-board characterization parameter |
53.3 |
°C/W |
Best Regards,
Bala Ravi