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TLV4170: Does this component can be soldered in a reflow oven? if so, Can you recommend a profile or tell us it characteristics such as resistance to reflow heat?

Adrian Baltazar
Prodigy 10 points
Part Number: TLV4170

We manufacture medic devices, and as a paradigm we've been told this component can only be soldered manually. But this is slowing our process quite hard. This is why we need to know if we can make this component a part of our SMT process. Thanks for your help and support.

  • 0
    TI__Genius 15410 points

    Hello Adrian,

    To my knowledge the TLV4170 will have no issues being used in a reflow oven.

    We typically do not recommend reflow profiles because the reflow profile depends on the types of solder paste and flux used, number of heating and cooling zones, and other factors.

    I recommend reading "MSL Ratings and Reflow Profiles" application report for more information.

    I also recommend taking a look at our quality and reliability page for the TLV4170 where you will find the MSL/reflow ratings. You can find the quality and reliability page by clicking on the Quality and packaging tab (next to the order now tab) on the TLV4170 web-page. Then click on "View" under Material Content for the device package you are using.

    Thank you,

    Tim Claycomb