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Original question:

LM358A: LM358AP electrical test curve offset

LM358A: irregular dots on LM358AP die chip

Jodie Zhu
Prodigy 50 points
Part Number: LM358A
 Followup with the material test. We found tough material surface. The attached photos can see several particles standout. Should we be concerned? Why would there be dots on the die chip? Would this affect product's usage?
 
  • 0
    TI__Guru*** 140126 points
    Jodie,

    This looks like residue from the package material as an artifact of removing the decapsulation. I have perform this task many times but last time was more than 10 years ago. These last bits of package material are difficult to completely remove. These particles are on top of the protective overcoat and therefore well outside the active circuitry. This placement can be verified by adjusting the focus point up and down. Low focus will make red areas silicon (lower elevation) in focus. High focus makes metal and particles in focus. I will ask internally for a second opinion.
  • 0 in reply to Ron Michallick
    TI__Guru*** 140126 points
    Jodie,

    FA engineer also thinks dots are from packaging and decapsulation process.

    "From the optical images alone, it’s very difficult to conclude exactly what the dots are. SEM and EDX analysis would be much more conclusive.
    But regardless of what exactly they are, I would say that they are very likely just artifacts of their decapsulation process."