TLV9004: Soldering w/o Thermal Pad for RTE Package

Kotaro Yamashita

Intellectual 2150 points

Part Number: TLV9004

Hey Team,

My customer would like to be soldering w/o thermal pad about TLV9004IRTER. Is there any issue on this configuration?

I've recommended soldering thermal pad but customer prefer this.

If they should, via is also required?

Regards,

Kotaro Yamashita

over 4 years ago

0 Paul Goedeke over 4 years ago

TI__Mastermind 30600 points

Hi Yamashita-san,

It is important that the thermal pad be soldered and connected to V-. We have an application note on fabrication with QFN / RTE packages:
www.ti.com/.../slua271b.pdf

Vias are used to help dissipate heat and are discussed in Section 3.4.1 of the document.

After you have had the chance to read that document, let us know if you have other questions.

Best,
Paul

Amplifiers

Amplifiers forum

TLV9004: Soldering w/o Thermal Pad for RTE Package