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[FAQ] TLV9062: Dual or alternative PCB footprint for second sourcing P2P op amps, like TLV9062 in SOT23 package

Prodigy 20 points

Replies: 1

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Part Number: TLV9062

Hello,

I want to use the TLV9062 in DDF(SOT23-8) package in my design, but there is not another supplier that offers this package. Is there a way I can use the DDF package and have a second source for my design?

Besides TLV9062IDDFR, do you have any other amplifier options with the same package?

Thanks.

Katherine

  • Hi Katherine,

     Besides TLV9062IDDFR, we have a bunch of devices available now for the same package:

    • TLV9052IDDFR: 5MHz, 15V/us high slew-rate, RRIO op amp.
    • TLV9002IDDFR: 1MHz, RRIO, 1.8V to 5.5V op amp for cost-optimized systems
    • LM358LVIDDFR/LM2904LVIDDFR: 1MHz, industry-standard low-voltage operational amplifier

     If none of these devices meet your needs, please understand that the SOT23-8 (DDF) is a very popular package in the market because it not only provides a leaded package, which is easy for test and manufacturing, but also helps engineers save the PCB area with only 1.60 mm × 2.90 mm body size. In the near future, more and more devices in this package will come out.

     In case your concern is second sourcing, you could use a dual layout on your PCB.  You can choose either industrial standard package, such as SOIC-8 and TSSOP-8, or smaller one like SOT or SON as the second source.

     We have a good article “Second-sourcing options for small-package amplifiers” available in ti.com, which may be helpful for your question. It discusses how to provide a second-source option for small-package amplifiers that do not have a direct pin-to-pin-compatible second source. Also covered are the possible manufacturing and design challenges the designer may face during printed-circuit board (PCB) layout. Figure 1 illustrates how this works in a PCB layout with SOT23-8 and SOIC-8 packages.

     

    Finally, if you’re concerned with supply, please know that the TLV9062IDDFR is built on 12 inch (300mm) wafers, which offer much greater capacity than 6 or 8 inch wafers.  Combine that with our advancements in manufacturing technology and there should be little or no concern about supplying the device.

     Thank you,

     Tim Claycomb

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