LMV321: PCN of RevW → Rev.X

Yuto-san,

The build of the LMV321 has not changed [as of this date]. The data sheet changes may not have [will] required a PCN. I will check on Monday to see if there was a PCN. The DCK thermal is a tiny bit lower now 239.6 C/W, it was 252.0 C/W.  DBV is higher at 232.9 C/W when it was 206 C/W. Thermal modelling algorithms improve over time, so small differences are common. [Any change in the build can affect thermal resistance]  

Hi Ronald-san,

Thank you for your reply.
What is the case that the PCN cannot be created even if the specifications are changed?
What is the background of this revision (W→X)?

What are you doing to improve your thermal modeling algorithms?

Best regards,
Yuto Sakai

Yuto-san,

I originally did not find the PCN because the approval process is not yet complete. There will be a PCN and the build step(s) of the LMV321 will change after the process is complete. Therefore the thermal change is not a modeling improvement; it is related to the PCN.

Here is information listing PCN events.

https://www.ti.com/support-quality/quality-policies-procedures/product-change-notification.html

Hi Ronald-san,

Does it mean that a PCN will be created when the approval process is complete?
Also, if the model is not improved, why is the thermal resistance changed?

Best regards,
Yuto Sakai

Yuto-san,

Yes there will be a PCN. Thermal resistance is based on many factors such as but not limited to: leadframe, die size, die thickness, die attach compound, mold compound. The PCN will change one or more of the items in the list, therefore the thermal resistance will change.

Hi Ronald-san,

I'm sorry, I made a mistake in the thread to post yesterday.
By the way, when will LMV321 PCN be created?

Best regards,
Yuto Sakai