Hi TI team,
I designed a PCB where I use 2 INA260 in parallel to measure current up to 30A continuous and up to 40A with 60s current pulse. I'm using a thermal imaging camera to check the chip temperature at high current rate.
I see the shunt temperature to rise up to 125°C at 30A continuous and around 150°C at 40A after few seconds. The ADC part of the chip seems to remain in the operating range temperature.
I'm not sure if it is safe to use or if I have to change the PCB layout. In the datasheet is stated that the maximum junction temperature is 150°C. Does it refer to the shunt part of the chip or it can reach higher temperature?