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THS3491: THS3491 VQFN Land Pattern

kodama
Prodigy 20 points
Part Number: THS3491

Hi team

Please answer the following questions regarding the use of the THS3491 VQFN op amp.
(THS3491IRGTR)

As a prerequisite
Due to our circuit design, THS3491 has a peak current of 750mA and a steady state of 50mA. The power supply conditions are Hi = 12.5V and Low = -4.5V.

Q1.
Please tell me the required number of vias when designing with the prerequisites.
Is it necessary to place 5 points of thermal pad via design φ0.2mm from the data sheet? Also, please tell me the reason for this via design.

Q2.
With our board mounting, the minimum via diameter is φ0.3 mm. Considering the opening area of ​​the metal mask, only one via can be placed under the thermal pad.
At this time, when designing with the preconditions, is the number of vias sufficient with one via of φ0.3 mm? How many do you need if you don't have enough?

  • 0
    TI__Mastermind 22280 points

    Hello,

      The vias are placed underneath the package for efficient heat dissipation. The more vias you have, the faster heat dissipation of the board you will achieve. Your peak current of 750mA is worrying since it is higher than specified in the datasheet. But, at your steady state, having one or two vias should be adequate. Would you be able to place more vias on the board surrounding the part?  If you would like more information on the topic, here are some app notes with more insight: Thermal Design, PowerPad, Layout, PowerPad Brief.

    Edit: I was able to fit 4 0.3mm vias on thermal pad of the THS3491IRGT, would you be able to provide a image of your PCB project at and around the package?

    Thank you,

    Sima

  • 0 in reply to SimaJalaleddine
    Prodigy 20 points

    Hello, Shima

    thank you for your answer.
    The PCB data we are designing and considering is subject to confidentiality.
    Therefore, I would like to talk to you directly by email as offline suport reqest.

    Thank you in advance

  • 0 in reply to kodama
    TI__Mastermind 22280 points

    Hello Kodama,

       We can continue communication via email: s-jalaleddine@ti.com 

    Thank you,

    Sima