OPA330 XBGA package mechanical info

Hi TIguru,

I see that page 36 of the datasheet should not have been included. You're right, we don't have a 25 pin package for the OPA330. Page 37 is more relevant and it still doesn't include the "D" and "E" dimensions.

From http://www.ti.com/sc/docs/psheets/jedec/s_xbga_n.html I was able to find the following information:

I think "D" and"E" are the width and length, respectively.

I will see if I can get the correction in the datasheet.

Regards,
Chris

TIguru,

Figure 25 in the OPA330 datasheet is correct.

The TI package website dimensions are the max dimension of that package. This type of package is unique that the actual package dimension size varies with the size of the die inside. Therefore, we specify the exact size of the package in the datasheet. Page 37 doesn't show these dimensions since it is a generic diagram that is used for all of the YFF packages.

Best regards,
Chris