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ONET8551T: Exact Pad Locations and Adapting for Flip Chipping

Part Number: ONET8551T

Hello,

I am interested in a bit more information regarding the ONET8551T's pad layout. I completely understand that the device is designed for wirebonding, but we are planning to try flip chipping it to an interposer, which makes getting the pads right crucial. First, is it possible to acquire a GDS file (just for the pads)? If that is not possible, I would like to confirm that the coordinates on page 9 of the datasheet are all referenced from the center of the pads (and not a corner)--is this correct? Finally, I would be interested in knowing if you there are other immediate concerns that jump out to you regarding attempting to flip chip the device. I see the back is intended to be grounded...could that be grounded with a wirebond to a ground on the interposer? Are there any other similar considerations that should be taken in adapting the device for flip chipping?

Thank you,

Nathan

  • Hi Nathan,

    I am looking to see if we can get a GDS file for you. If not, we can at least confirm the coordinates. As long as you are able to get good ground connections on the ground pads, that should be suitable to properly provide a ground to the device.

    We haven't ever tried to connect the device as a flip-chip so I am not sure if you might run into any other issues. Assembly stresses are always something to be aware of when bonding the device.

    Regards,
  • Hi Nathan,

    I don't think it will be easy for us to provide a GDS file, but I did confirm that the pad locations in the datasheet are referenced to the center of PAD1 (0,0) and are accurate.

    Regards,