We've been unable to get a good solder joint on the ground surface of this component. It looks like the leads are holding the ground surface up above the surface of the PCB, so the solder has to bridge that gap. When I reviewed the data sheet, it says that the package's ground surface IS as far as .15 mm above the leads. Then the following page only recommends a stencil that is .127mm thick. Does TI stand behind this recommendation? How am I to bridge a .006" gap with only .005" of solder paste?