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THS4032: Data sheet stencil thickness recommendation correct?

Part Number: THS4032

We've been unable to get a good solder joint on the ground surface of this component. It looks like the leads are holding the ground surface up above the surface of the PCB, so the solder has to bridge that gap. When I reviewed the data sheet, it says that the package's ground surface IS as far as .15 mm above the leads. Then the following page only recommends a stencil that is .127mm thick. Does TI stand behind this recommendation? How am I to bridge a .006" gap with only .005" of solder paste?

  • Hi Dave,

    I am looking into getting this question to one of our packaging experts. We will get back to you shortly.

    Regards,
  • Hi Dave,

    Below is the response from our packaging team. Please let me know if you have any questions.

    The device involved is THS4032 in PowerPad package (DGN).
    The standoff (bottom of the thermal pad to bottom of the lead)
    is 0.05-0.15mm per JEDEC MO-187.

    Due to various customers mounting conditions, we provide a table
    of different stencil thickness from 0.1-0.178mm.

    If you are using a 0.127mm thick stencil and have difficulty in
    getting a good connection between thermal pad and PCB, there
    are several that they can try.

    1. Adjust solder paste printing setting (reduce speed and increase pressure).
    2. Increase the stencil aperture.
    3. Increase the gap between PCB and stencil during paste printing.
    4. Fabricate a step stencil, plate up a certain area of the stencil to
    increase the thickness.
  • I see the table now- yes this helps! Thank you!