Hi Guys,
Good day.
I need support from TI side, or any advices on the below issue that i face.
I highly suspect that the below defect is a "pop corn" effects as there is blistering and a very small hole there.
So basically this is a MSL level 3 IC and i was just asking TI technical staff if they are able to share or let me know which area in the IC is sensitive to moisture.
Basically with that data, i am able to conclude that the hole is cause by "pop corn" effects.
I only have limitation on the IC, where i could only do X-Ray on the IC.
Thanks.
BR,
Benji