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DRV8302: Location of IC which is prone to moisture.

Part Number: DRV8302

Hi Guys,

Good day.

I need support from TI side, or any advices on the below issue that i face.

I highly suspect that the below defect is a "pop corn" effects as there is blistering and a very small hole there.

So basically this is a MSL level 3 IC and i was just asking TI technical staff if they are able to share or let me know which area in the IC is sensitive to moisture.

Basically with that data, i am able to conclude that the hole is cause by "pop corn" effects.

I only have limitation on the IC, where i could only do X-Ray on the IC.

Thanks.

BR,

Benji

  • Hi Benji,

    You should consider all inner die locations sensitive to moisture.

    Did this crack/hole occur after reflow and before initial power up of the device?

    Please refer to www.ti.com/.../snoa550e.pdf to ensure proper nandling and process procedures
  • Hi Rick,

    Thanks for the reply.

    I put this post up because the FA lab analysis consider this issues as an EOS / burnt and the RC is due to solderballing (which i think it's not the actual RC).

    But from my experience that this image looks more like a pop corn effect due to MSL.

    (Magnified - 50X)

    Yes, it had gone through the SMT reflow once and of course a dip process too - Heating elements.

    We detected this during the ICT testing and found this IC to be rejected (board yet to be powered up). We have been using this IC for more than 3 years and only so far this is the only piece rejected (and of course management team wants an answer for this on the RC analysis and CA.)

    Solderability is good - no sign of rework nor rework history for this board.

    Thanks.