OPA4132: The appearance of OPA4132

Hi Lerry,

1. Why the typing in the bottom circle of the same batch is different.

My guess is that the dies are fabricated a a given time, and the IC encapsulations could happen at later or different date. These encapsulation markings are typically associated with encapsulated date, week of the year, location etc.  The final packaging in reel or tubes may be done at different location, which I do not know these details. 

If you are buying these op amps from TI approved distributors or TI store, then you should not concern about these markings. 

2. Why is there a hole in the plastic seal of the sample --> Will it affect the use of the product.

Can you take a high resolution picture of the hole? I am unable to see the shape and location of the hole in details. How many samples do you observe this issue?

The "plastic" seal is epoxy molding compounds. If there is an air bubble in the injection line or nick during curing/machine-handling/packaging process, it may leave some kind of mechanic defects. I need to see the perimeter of the hole in order to make an estimation (prefer to view and take an image under microscope). 

If this is a surface phenomena or shallow in depth, I would not worry about. Please send me the high resolution and close-up image and I will take a look at it. 

Best,

Raymond