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OPA1632: Operational Amplifier(single ended to differential)

Part Number: OPA1632

Dear Sir, 

We are using OPA1632 IC ( Single-Ended to Differential ) but ICs are more Heat generating Please Let us know the cause of Heat Dissipation. We Are Used  2 Layer PCB. below mentioned the Schematic Reference, please solve the issue ASAP

  • Hello Pavan,

    Could you confirm which IC package type you are using on your board?  If you reference Section 6.4 Thermal Information in the datasheet, you can see there is a variance between the SOIC and MSOP-Power Pad packages with respect to thermal characteristics.  Please see this application note for details on thermal information:

    Could you also confirm the stack-up/layers on your 2-layer PCB?  Where are GND, Power, and Signal traces/pours?  

    I will look over the part and be prepared to assist.



  • All I can say is that these guys are firebreathers. Quiescent power draw is 14 mA. Data sheet says that's 'per channel' but the part is a single-channel device so it's not clear if that means it's 14 mA per rail or what.

    Compare that to some common op-amps, which often draw less than 4 mA quiescent.

  • Hello Andy,

    I will also look into the quiescent current and report back whether it is 'per-channel' as you have understood it, or if the spec is intended to convey something else.



  • Hello Pavan, Andy,

    I can confirm the Iq for the device is correctly specified at 13mA TYP, 17.3mA MAX for D package; the DGN package is specified at 14mA TYP and 17.1mA MAX.

    Could you provide answers to my requested information in my earlier response?  Without knowledge of your package type, board details, and load information, it will be difficulty to provide sufficient assistance.