DRV135: Junction to board and junction to case specification

Nihil,

Many of the older device only provide a Junction-to-Ambient specification.  This is really sufficient in most cases as the internal die has minimal thermal connections to the PCB and heat-sinks are not normally used on this style of device.  The data sheet does provide Theta-J-A.  Below is a sample calculation of self heating using Theta-J-A for a DC load.  This video covers the details on these calculations:  Power and Temperature 

Best regards,

Art

Thanks Art, this is helpful!