LM4871: LM4871MX/NOPB - Required PCN Document for Wire bonding changes

manoj balakrishnan

Part Number: LM4871

Hi Experts ,

Good Day ,

Can you please check and confirm below image which is having the wire bonding changes and Bottom markings are consistent with TI requirements ? . Both the date codes were belongs to Malaysia.

Please help us to take the correct PCN behind these changes .

Looking forward for your valuable support .

Regards

Manoj Balakrishnan.

over 2 years ago

0 manoj balakrishnan over 2 years ago

Intellectual 405 points

Hi Experts ,

Looking forward for your support on this matter.

Thank you

Manoj Balakrishnan

0 Ivan Salazar over 2 years ago in reply to manoj balakrishnan

TI__Guru** 111825 points

Hi Manoj,

This seems like a different leadframe and die itself as well. You may start a counterfeit validation following these instructions: Anti-counterfeit | Quality policies & procedures | Quality & reliability | TI.com

Best regards,
-Ivan Salazar
Applications Engineer

0 manoj balakrishnan over 2 years ago in reply to Ivan Salazar

Intellectual 405 points

Thanks for your advise . We will reject the parts .

0 manoj balakrishnan over 2 years ago in reply to manoj balakrishnan

Intellectual 405 points

Hi Ivan ,

One more support we need from you.

Can you please check the images of DC 2208 alone and confirm us the acceptance ?

Let us know which one is correct to avoid the further confusion on these parts.

Thank you

Regards

Manoj Balakrishnan.

0 Ivan Salazar over 2 years ago in reply to manoj balakrishnan

TI__Guru** 111825 points

Hi Manoj,

Given the diagram and table from data sheet pages 13/14, DC1903 seems closer to the description.
However, I don't really know the history of this device and if there was a change in die, leadframe or bond wires in the past. For that matter a counterfeit analysis would be better.

Best regards,
-Ivan Salazar
Applications Engineer

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LM4871: LM4871MX/NOPB - Required PCN Document for Wire bonding changes