I am using thermal paste between top of the IC and the external top mounted heat sink. My reading suggests that the heat sink needs to make actual contact with the IC. Is this correct? I am concerned about the weight of the heat sink eventually causing stress on the package IC pins (it's a big heat sink). How to account for variations in IC package, IC soldering, and heat sink to keep either a.) contact with the IC if that is recommended, or b.) the recommended clearance between the top of IC and heat sink for the paste.
-
Ask a related question
What is a related question?A related question is a question created from another question. When the related question is created, it will be automatically linked to the original question.
