PCM2704C: [Question] PCM2704CDB Latest PCN 20250516004.1 Notification (Product Change Notice)

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Part Number: PCM2704C

Tool/software:

Hello.

There is no effect on the electrical characteristics, but I understand that the bonding wire inside the IC has been changed from gold to copper due to a change in the manufacturing plant.

Can you confirm whether the mold compound material has properties that will prevent this bond wire from sulfurizing?

If the mold compound material "4211880" is sulfur-free, there should be no problem.

[References]：eetimes.itmedia.co.jp/.../news033.html (Japanese)

The English version is as follows:

[Encapsulating material that can be used with copper wire for long-term heat-resistant applications]

7 months ago

+1 Arash Loloee 7 months ago

TI__Mastermind 32951 points

Hello,

I believe 4211880 compound should have no problem with copper wiring . Please refer to this link ( from product page you can also access it). In the Material content section , it lists all the material that is in the compound.

https://www.ti.com/quality-reliability-packaging-download/report?opn=PCM2704CDB

Regards,

Arash

+1 Arash Loloee 7 months ago in reply to ?? ??

TI__Mastermind 32951 points

You're most welcome.

The link I sent above lists all the material that is in the compound. In general for any IC you can find the list from its product page . at the bottom of the page from ordering and quality, select Quality, reliability & packaging information view and it gives you all information you need.

https://www.ti.com/quality-reliability-packaging-download/report?opn=PCM2704CDB

Arash

+1 ?? ?? 7 months ago in reply to Arash Loloee

Prodigy 40 points

Hello.

>> I believe 4211880 compound should have no problem with copper wiring but I will confirm by Friday afternoon.

Thank you for your reply. I understand. Thank you in advance.

+1 ?? ?? 7 months ago in reply to Arash Loloee

Prodigy 40 points

Hello.

Thank you for your reply.

I downloaded "PCM2704CDB.xlsx" and "PCM2704CDB.pdf" and checked the chemical composition of the mold compound.

I investigated the chemical composition of the mold compound to see if it contained sulfur (S), and it should not contain any sulfur (S). So I would appreciate it if you could let me know if the "4211880" compound is okay for copper wiring.

+1 ?? ?? 7 months ago in reply to ?? ??

Prodigy 40 points

Hello.

I have a question for you as a reminder.

>> I believe 4211880 compound should have no problem with copper wiring but I will confirm by Friday afternoon.

Please tell me the answer.

Please reply whether the 4211880 compound is safe to use on copper wire.

+1 Arash Loloee 7 months ago in reply to ?? ??

TI__Mastermind 32951 points

Hello,

The compound page is for this reason : to show the users the material used in the compound to address their concerns as well.

I have never heard of any issue with this compound and last week I confirmed my answer by sending you the link on that post itself.

Based on the article that says sulfur can cause issues with copper wiring, the components of 4211880 compound doesn't have any sulfur and should be ok.

Kind Regards,

Arash

0 ?? ?? 7 months ago in reply to Arash Loloee

Prodigy 40 points

Hello.

>>I have never heard of any issue with this compound and last week I confirmed my answer by sending you the link on that post itself.
>> The components of 4211880 compound doesn't have any sulfur and should be ok.

Thank you for your reply. I understand.

On a different note, silver sulfide is just for reference.
The chemical reaction between silver and sulfur produces silver sulfide, which can be problematic. This was pointed out by the designer.

The plating selected this time is not limited to silver sulfide, and the intention is to confirm whether such chemical reactions occur in general.

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PCM2704C: [Question] PCM2704CDB Latest PCN 20250516004.1 Notification (Product Change Notice)