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TPA2006 Thermal Pad Not Connected to GND

Terence Gilhuly
Prodigy 50 points
Other Parts Discussed in Thread: TPA2006D1, TPA2006D1EVM

hi guys,

This is late, but I've come across something similar recently.

Do the same issues of potential undesired behavior happen with the TPA2006 amplifier chips without an ePad connection?

What can be expected when the epad is not connected for them (the TPA2006)?

thanks for your time,

Terence

  • 0
    TI__Guru**** 189399 points

    Hi, Terrence,

    In the TPA2006D1, the PowerPAD should be tied to ground. This is for two reasons: thermal performance and grounding.

    Without the pad soldered down, you won't achieve the rated power of the amplifier, and depending on your application, may not achieve the performance possible with this device. 

    d2

  • 0 in reply to Don Dapkus
    Prodigy 50 points

    thanks d2,


    So there might be the same functional output, but at lesser output power than with grounded EPAD and possibly only up until the point that temperature becomes an issue (when it may shutdown due to thermal protection).  Is that right?


    Would you know of an equivalent part in a DIP package or something more easily breadboarded for labtesting?

    thanks again,
    T

  • 0 in reply to Terence Gilhuly
    TI__Guru**** 189399 points

    Hi, Terrence,

    You got it!

    Unfortunately, we typically don't have many DIP-packaged parts. 

    However, we do offer an EVM to help you do lab testing: TPA2006D1EVM.

    Or, you could try some thermal grease under the PowerPad (if you have ground plane).

    Or, a "hot air pencil" and some solder paste in a syringe. 

    Or, SMT soldering with an electric skillet (look on the internet for examples).

    -d2

  • 0 in reply to Don Dapkus
    Prodigy 50 points

    thanks d2,

    Too bad about the DIP but thanks for your help and the fun suggestions.


    have a good day,

    T