Dear TI:
Re this datasheet:
TPA6101A2
"50-mW ULTRALOW-VOLTAGE, FIXED-GAIN STEREO HEADPHONE"
AUDIO POWER AMPLIFIER
SLOS331C − AUGUST 2000 − REVISED MARCH 2007
page 1, page 18 shows SOIC package with a dot near pin 1, but the package I received (from Newark) has a bar at one end, but no dot, no notch. Your pictures on these pages, and your text say nothing about a bar. How would a customer know if they've soldered their chips in backwards? Where is pin 1?
I suggest you modify your datasheet ASAP to clarify this issue for other customers.