I have a design using a TAS5754M chip to drive 2 8-ohm speakers. I also have a system prototype that uses the TAS5754M EVM's U1 signal chain to do the same. PVDD is 24 Volts for my design and for the EVM-based prototype. I modeled my design on the U1 connections and layout on the TAS5754 EVM. There is a very large difference between the temperature of the TAS5754 on the EVM-based prototype vs my design. For example, with a 500Hz sine wave, 8 ohm speaker on the speaker-A output, R62 set for -10 dB the TAS5754 chip on the EVM prototype is at 38 degrees C while the TAS5754 chip on my design is at 70 degrees C. My layout does not have quite as much copper fill connected to the TAS5754 thermal PAD as the EVM layout has, but I don't know if copper fill size alone can account for such a huge temperature difference. Are there some other considerations that I might be missing? For example, is there some way my design could be creating some sort of imbalance between the + and - speaker driver legs that could cause a big power dissipation in the chip? I can send schematic and gerbers if someone can look at this.
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