Hi,
I'm working on a new design with the TLV320AIC12K CODEC, and am trying to figure out how the thermal pad on the QFN (AHB) package should be connected. The datasheet (Jan 2007 revision: http://focus.ti.com/lit/ds/slws115e/slws115e.pdf) has two differing comments:
- Pg 3 : For the RHB package, connect the device thermal pad to DRVDD.
- Pg 50: For devices in the RHB package, connect the device thermal pad to DRVSS.
Does anyone have advice as to which is correct?
Thanks for your help.
Perseid