Hello
I had wrote following Post on Dec. 2015, but I had no answer yet.
My customer pushes me about this, so I change hte subject name and change my question.
https://e2e.ti.com/support/amplifiers/audio_amplifiers/f/6/t/472885
Customer want to use the Thermal interface silicone soft pad rather than grease of Shin-etsu..
The reason is to manage the height mechanically between heatsink and top of DDV package Power Pad is easy if customer use silicone soft pad.
( soft pad absorbs the tolerance.)
However, TPA3251EVM recommend grease .
( Also, customer is concerned about overheat if silicone soft pad used.)
In the EVM design,
Heat sink height is 1.0mm and DDV package height is 1.2mm. please see attached.
Customer is concrened about the mechanical stress for IC package also.
Question1
Abut the meaning of 1.0mm of heatsink drawing. ... see attached.
Is the mechanical height of heatsink 1.0mm is MINIMUM value, and 1.2mm MAX value?
Or, 1.0mm is TYP value?
Question2
Don't you have no concen( do you?) about mechanical stress even if heatsink height is 1.0mm (typ) and DDV is 1.2mm max?
Please let us know about the your heatsink design guideline in regard to TPA3251 .
We already have your advise that 95N to power pad top is no problem.
Best Regards
Would you please let me know the guideline for designing the heat sink in case soft pad?
( guideline means the mechanical
Q2