Part Number: TPA3118D2EVM
Other Parts Discussed in Thread: TPA3118D2In TPA3118D2EVM, for get a better thermal connection, big copper area without any resist film under the IC.
(refer to TPA3118D2EVM datasheet P.9)
When designing for production, how should we design the shape of resist film under this amp IC?
I'm afraid of soldering defect because of opening resist film large area.