A customer is looking to use the TAS5414C-Q1 in a design and have a few concerns. It appears that there is a dot indicator for the pin1, but there is also a dent on the bottom side of the package. Which is the actual pin1 indicator?
Also, we understand that this device was designed for a top thermal pad with a heat slug, but why do the layout instructions in the app notes for the device say to have a GND thermal pad on the bottom of the board when there is no pad on the IC package?
Thanks,
Matt
