TPA3251: A guideline for implementation of a heat sink

Kuramochi Tadahiko

Part Number: TPA3251

Hi,

Does anyone have A guideline for implementation of a heat sink?

My customer is trying to implement heat sink and afraid to exert force to IC's package or pins by contacting IC and heat sink.

Should we concern such a thing?

Best Regards,

Kuramochi

over 5 years ago

0 Robert Clifton56 over 5 years ago

TI__Mastermind 28150 points

Hello Kuramochi-san,

For a general rule we use 60-80 Ncm of torque to tighten the M3 screws for our heatsinks on our EVM boards. Also for a reference our heat sink looks like this:

media.digikey.com/.../ATS-TI10P-519-C1-R3.pdf

I hope this helps clarify things for you!

Best Regards,

Robert Clifton

0 Kuramochi Tadahiko over 5 years ago in reply to Robert Clifton56

Guru 28715 points

Robert-san,

Thank you for your information.

>For a general rule we use 60-80 Ncm of torque to tighten the M3 screw

Many EVMs are manufactured on this condition, right?

Best Regards,

Kuramochi

0 Robert Clifton56 over 5 years ago in reply to Kuramochi Tadahiko

TI__Mastermind 28150 points

Kuramochi-san,

Yes that is correct. Our manufacturer should be tightening the heatsinks to about that torque level. Though during shipping and handling it's possible some get loosened.

Regards,

Robert Clifton

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TPA3251: A guideline for implementation of a heat sink