Other Parts Discussed in Thread: TS3A227E
Hi Team,
Would you please help for the TS3A225 schematic and layout review?
txn.box.com/.../00md88lbzwuaf1oy3xawjhxej8wsaki0
BR,
SHH
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Hi Team,
Would you please help for the TS3A225 schematic and layout review?
txn.box.com/.../00md88lbzwuaf1oy3xawjhxej8wsaki0
BR,
SHH
SHH,
1. VDD is correctly supplied with 3.3 V which is within the recommended operating conditions bypass capacitors are recommended to be placed as close to the IC as possible.
2. SCL and SDA are open drain outputs and are correctly pulled up to 3.3 V
3. MIC_PRESENT is open drain output and is correctly pulled up to 3.3V
4. MIC_P should be connected to codec
5. ADDR_SEL is correctly grounded
8. GND correctly connected to ground
9. SLEEVE and SLEEVE_SENSE correctly connected to audio jack but R517 should not be connecting SLEEVE To MICP
10. RING2 and RING2_SENSE correctly connected to audio jack
11. TIP_SENSE is correctly connected to the tip of the headset.
12. DET_TRIGGER pin to initiate the automatic detection sequence is correctly held low until headset is inserted and then will be pulled up to 3.3V through JACK500_P3V3 node. R518 should not connect DET_TRIGGER to MIC_PRESENT.
Thank you,
Adam
SHH,
Are you trying to permanently ground ring2 to support only CTIA headsets? If you are permanently configuring the audio jack for a specific headset you will not need the TS3A225E audio jack switch. The audio jack switch simply gives the flexibility to support different headsets. If you are only supporting CTIA you won't need the IC.
If you remove R533 how will the audio signal get between the TS3A255E and the audio jack?
Please also review this posting to learn how the audio jack detection works which applies to all of TI audio jack switches.
Thank you,
Adam
SHH,
Is there a good time that we can talk over the phone? I don't think we are communicating properly about the function the TS3A227E provides and what the customer is trying to achieve in the system. If you are only supporting one type of headset that has ground on Ring2 pin only and Mic on sleeve pin only you do not need to use the TS3A227E in they system.
Thank you,
Adam
SHH,
The CTIA headset has the ground pin on Ring 2 of the audio jack. The link to the schematic expired but if you pull down the Ring 2 pin to ground with a resistor then it will only support CTIA headsets and not the microphone on the OMTP headset because the microphone line will be grounded.
I don't know the configuration and impedance of the Apple and Nokia headsets but if you permanently ground Ring 2 of the audio jack it will only sport the headset with the mic on sleeve.
I did a google search and it looks like some apple headsets have the ground on Ring2 which will work if you ground Ring 2.
I did a google search and it looks like some Nokia headsets have the ground on Sleeve which will not work if you ground Ring 2.
Thank you,
Adam