Hello,
I have a question regarding vias on the die attached pad (DAP) of the LMX2615-SP. Is the recommendation for strong grounding of the DAP primarily for thermal or RF reasons? I imagine both. I am working on an 8 layer design where the top 4 layers are RF only, and the bottom 4 layers are for digital and power routing. I am trying to get away with only connecting the DAP to GND through 1:4 vias, not 1:8 vias. Thermally I should be okay with this, but are there any RF concerns you would have with this approach? I would ensure that all bypass caps around the LMX2615-SP are also grounded through 1:4 vias if going with this approach.
Thank you!
