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CDCM7005-SP: max component height with tolerance

Renan Santos Adriano
Mastermind 21630 points
Part Number: CDCM7005-SP

Hello Team,

My customer has 3 questions regarding part number 5962-0723001VXC with the goal of determining max component height and making sure this part number can be used in their module design.

Regards,

Renan

  • 0
    TI__Genius 15635 points

    Hi Renan,

    I'll get back to you on this; I'm checking with our packaging team.

    Regards,

    Jennifer

  • 0
    TI__Genius 17125 points

    Hi Renan,

    Detail B shows the tiebar, which is removed before the unit is attached to the board.  The customer will do a trim of the leads and form them for attaching to a board.

    I believe the maximum thickness of the lid, highlighted in red in picture, is .287 mm.  I will double check on that.

    I will also have to do some research on low far out the heatsink extends (marked in yellow).  I hope to have an answer for you by tomorrow.

  • +1 in reply to Kirby Kruckmeyer96848
    TI__Genius 17125 points

    I confirmed the max  thickness of the lid is 0.287 mm.

    As shown in the diagram, the heatsink sticks out 0.762mm from the package.  The variation is +/-0.13mm.

  • 0 in reply to Kirby Kruckmeyer96848
    TI__Mastermind 21630 points

    Hello Kirby,

    Good day, just a follow-up inquiry:

    Since the max thickness of highlighted red lid is .287 mm [.011 in], then does that mean highlighted purple leads position/thickness could extend further at .022 in worst case (i.e. .014 + .008 = .022)?

     

     

     Based on the latest information, then worst case max component height would result in .022 in + .090 in + .030 in + .005 in = .147 in.

    Please also verify we agree with .147 in as the worst case max component height.

    Would you also please comment on if we could flatten the leads against the main body of the component to reduce max component height to .287 mm [.011] for the lid (i.e. since flattened leads would be .008 max and less than .011)?

     

     I’m wondering if the above would damage the integrity of the form, fit, function of the component and if any warranties/performance would not be guaranteed if we wanted to flatten the leads.

     If we were able to flatten the leads and then form like noted above, then worst case max component height would result in .011 in + .090 in + .030 in + .005 in = .136 in.

    Regards,

    Renan

  • +1 in reply to Renan Santos Adriano
    TI__Genius 17125 points

    Hi Renan,

    You are correct in that the leads stick up higher than the lid.  

    I am not sure I understand your calculation from max height.   From Detail 3, the max distance from bottom of the ceramic to the top of the leads is 0.105.  The you just need to add the 0.03 (plus the tolerance) that the heatsink projects out from the ceramic.

    The leads are designed that way so you can get a nice rounded bend when you do trim and form.  It also allows flexibility in the leads for improved board level reliability.  I don't know what the ramifications would be if you flattened the leads at the point where they are brazed on the package.  I will check within TI to see if I can get additional guidance.  You might want to check with whoever would be doing the trim and form for you and see if they have experience with this.

  • +1 in reply to Kirby Kruckmeyer96848
    TI__Genius 17125 points

    Our package expert confirmed that flattening the leads may cause stress or damage to the leads and might impact their reliability.