This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LMK5C33216: maximum force to be applied on tpackage

Part Number: LMK5C33216


Please advise the maximum force to be applied on LMK5C33216 package, since it appears from the thermal simulations that adding a TIM material will help to dissipate the heat of this IC

Thank you,