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LMX2572EVM: LMX2572EVM Question regarding board thickness (from RF surface to ground layer)

Charles Turner1
Prodigy 30 points
Part Number: LMX2572EVM

I would like to design something similar to the LMX2572EVM board, but with additional components for filter and amplification. It would greatly reduce the transition from RF trace width to IC pin width if I used an 8 mil thick board instead of 16 mils like the eval board. What was the design consideration for choosing 16 mils (for the RF portion) as opposed to another width? Are there any design considerations for using a thinner board such as 8 mils?

  • 0
    TI__Mastermind 28960 points

    Hi Charles,

    Electrically, not much changes as long as the proper trace widths for impedance control are selected. If anything, the reduced thickness will reduce the power supply bypassing inductance, which is a small improvement. Likewise, there isn't much difference thermally, assuming the copper thickness remains the same between boards.

    Mechanically, PCB thickness differences can impact thermal cycling and general manufacturing tolerances, which can then have some impact on the RF signal integrity, the reliability of the solder joints, and the cost of assembly. For this kind of mechanical question, you can get a more thorough answer from your PCB fabricator.

    Regards,