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Part Number: LMC555

1. For the parts TPS22965NQWDSGTQ1 and LMC555IM/NOPB, please confirm the Part grade/quality level (For example: Automotive, Industrial, Military)

2. Per Materiel deceleration for parts TPS22965NQWDSGTQ1 and LMC555IM/NOPB, the Die to package or substrate wire bond/ball material is copper, if it is so then please provide me copper wire bond test report in accordance with AEC-Q006 or it is not a automotive part then pls provide the copper wire bond test report not from SGS Reach, but other copper bond test report.

  • Hello,

    I have checked on the LMC555 IM/NOPB and it does use copper wire.  Its JEDEC qualification report is available at


    The LMC555IM/NOPB it is not an automotive device, therefore it was not qualified per AEC-Q100 or AEC-Q006 standards.

    The quality, reliability and packaging data download for our devices can also be found here:

     If you repost your question with the TPS22965NQWDSGTQ1 only it will go directly to the support engineer. If you have any difficulty getting in contact with the support Engineer please reach back out here. The links above should provide you with the needed information.