1. For the parts TPS22965NQWDSGTQ1 and LMC555IM/NOPB, please confirm the Part grade/quality level (For example: Automotive, Industrial, Military)
2. Per Materiel deceleration for parts TPS22965NQWDSGTQ1 and LMC555IM/NOPB, the Die to package or substrate wire bond/ball material is copper, if it is so then please provide me copper wire bond test report in accordance with AEC-Q006 or it is not a automotive part then pls provide the copper wire bond test report not from SGS Reach, but other copper bond test report.