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ADC12DJ5200RF: Assembly Stack-Up/Material Properties

Part Number: ADC12DJ5200RF

Need to model thermo-mechanical effects of this device in a custom circuit board packaging application.  Can you please provide the necessary material properties (young's modulus, CTE, thermal conductivity) for the elements within this part, including any materials bonding the elements together? 

Datasheet side profile shows part constructed from 3 primary elements: (1) lower laminate, (2) die, and (3) lid/cover.  Assuming there is some type of material bonding (1) to (3).

If specific properties/stack-up cannot be shared, effective material properties and description of their use can be substituted.

Thanks