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ADC081C021: Underfill on the ADC

Part Number: ADC081C021

Hi experts,

Could you let me know if it is okay that a nearby IC is BGA package and need underfill, then underfill splatter on the ADC081C021?

Best regards,


  • Hello Hideki-san,

    The situation sounds undesirable versus a situation where the underfill is not splattering on nearby IC's.  Typical underfills are thermally conductive, but electrically non-conductive.  If the underfill is conductive then it could cause leakage or "short" challenges between pins on the ADC081C021.  Otherwise it is difficult to predict long-term impacts of this situation because it is not something we've actively tested for.