Hi experts,
Could you let me know if it is okay that a nearby IC is BGA package and need underfill, then underfill splatter on the ADC081C021?
Best regards,
Hideki
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Hi experts,
Could you let me know if it is okay that a nearby IC is BGA package and need underfill, then underfill splatter on the ADC081C021?
Best regards,
Hideki
Hello Hideki-san,
The situation sounds undesirable versus a situation where the underfill is not splattering on nearby IC's. Typical underfills are thermally conductive, but electrically non-conductive. If the underfill is conductive then it could cause leakage or "short" challenges between pins on the ADC081C021. Otherwise it is difficult to predict long-term impacts of this situation because it is not something we've actively tested for.