ADC12D1600RF: Maximum solder reflow cycles

Richard Thompson

Part Number: ADC12D1600RF
Other Parts Discussed in Thread: ADC12D1000RF,

What are the maximum number of (solder) reflow cycles that can be applied to these parts to support troubleshooting.

Part is not suspect but needs to be removed to troubleshoot circuit card and is desired to be re-installed.

Regards parts ADC12D1000RF and ADC12D1600RF noted above.

0 Rob Reeder over 3 years ago

Hi Richard,

Let me check into this for you.

Thanks,

Rob

0 Rob Reeder over 3 years ago in reply to Rob Reeder

Hi Richard,

Please be mindful of moisture sensitivity when re-soldering the parts (it may require moisture bake-out; 24hr @ 125C).

As long as the balls are still on the BGA package, you should be able to re-work.

If the balls come off when the part is removed the device will need to have the balls re-attached.

Regards,

Rob

0 Rob Reeder over 3 years ago in reply to Rob Reeder

Hi Richard,

One more note....

Forgot to mention.. we do 3x reflow to qualify parts, in addition to the 1x reflow that happens at assembly (balls onto package).

We don't recommend more than 3x reflow.

Also, this paper below strongly recommends that removed packages be discarded:

Regards,

Rob

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