Hi Experts,
Good day.
Could you provide the following info for 5962R0722701VZA?
1. Junction to board thermal resistance
2. Junction to case(bottom) thermal resistance
Regards,
Josel
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Hi Experts,
Good day.
Could you provide the following info for 5962R0722701VZA?
1. Junction to board thermal resistance
2. Junction to case(bottom) thermal resistance
Regards,
Josel
Hi Josel,
The expert is out right now so I ask for your patience. I would expect an update late next week.
Thanks,
-Cole
Hello,
All the information available is listed in the datasheet, and the ADC128S102QML-SP SMD 5962R07227, which are both available in the device product folder
Also, there is a good application report about the topic that may help
How to Properly Evaluate Junction Temperature with Thermal Metrics
Regards
Cynthia
Hi Cynthia,
Good day.
I am referring to a Junction to case(bottom) value, not (Top).
And Would you also help provide the Junction to board thermal resistance?
Regards,
Josel
Josel,
All the information available has been provided.
The document listed explains how the junction to top may be used as junction to bottom, on a case to case scenario.
Regards
Cynthia
Hi Cynthia,
Good day.
If I am understanding correctly, the ThetaJC value listed in the data sheet could represent the resistance from the junction to the top or bottom of the case depending on the dominant heat path out of the component. So if this component's primary heat path is through the component and leads to the board then the ThetaJC value should represent the resistance from junction to case bottom, correct?
Regards,
Josel