DAC088S085: CISQ housing dimensions of thermal pad missing

Hi Jochen, 

You're correct, it looks like that critical piece of information is missing. I will look into this and submit a request for the datasheets to be corrected.

Thanks,
Erin

Hi Erin,

thank you for the fast reply.
After drawing the thermal pad with 2.6mm x 2.6mm into the contact rows we see a gap of only 50 Microns  ( = 2 mil) to the surrounding contact pads.
Thinking of tolerances I am afraid that there is some misfit.

Please  provide a recommendation for the solder stencil of the whole part.

Thanks,
Jochen

Hi Jochen,

I'll look into getting that for you. In the meantime, could you tell me how you got that result? From what I would expect:

4 (package width) - 2 * 0.55 (pin length) - 2.6 (thermal pad) = 0.3mm

Giving each side around 150 microns of space between the pins and the pad. Let me know if I'm incorrect in my assumption, though.

Thanks,
Erin

Hi Erin,
we calculated the worst case of all tolerances: 

Smallest Case size 3.9 mm - 2 x 0.65 mm (max. Pin length) = 2.6 mm

Thus there would be no space for a 2.6 thermal pad (it may also have a tolerance of +/-0.1mm).

Thanks,
Jochen

We are working to get a complete drawing.  We should respond today.