Tool/software:
I have seen the pin failure mode distribution for the IC from the the attached link (https://www.ti.com/lit/fs/sbaa467/sbaa467.pdf?ts=1736311872398&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FADS7038-Q1%253FkeyMatch%253DADS7038QRTERQ1%2526tisearch%253Duniversal_search%2526usecase%253DOPN-ALT)
In this Exposed Pad also considered in the pin failure mode analysis. So while performing reliability calculation using IEC 62380 standard whether number of pins should be considered as 16 or 17 (by including Exposed pad)