Part Number: DAC5672-EP
Tool/software:
I am completing a design that uses the DAC5672-EP.
On page 4 on the datasheet there is a reference to a power pad :
PFB PACKAGE THERMAL CHARACTERISTICS
PARAMETER POWER PAD CONNECTED TO PCB THERMAL PLANE
Thermal resistance, junction to ambient 63.7°C/W
Thermal resistance, junction to case 19.6°C/W
The device appears to have no power pad
Can you advise?
