Please advise me the following questions.
When DAC081C085CIMM/NOPB datasheet was searched, there are several version of datasheets was up loaded on IT web.
As attached, one is NS original version with TI front page (file name: dac081c085(NS).pdf). The second datasheet is full TI style
(file name: dac081c085(NEW TI).pdf) which was downloaded last week. The last one is same TI style but updated from one in last
week (file name: dac081c085(NEWEST TI).pdf).
I have the following questions.
Please give me answers to these question.
I appreciate it if you can give me answer in a couple of day to keep design due date.
Q1 Please let me know which revision datasheet you can refer to design PCB?
Q2 The MSOP package shown on the NS revision datasheet is identical to VSSOP package
on the new revision datasheet (Newest TI)?
Q3 Compering the mechanical dimensions of MSOP and VSSOP packages, there are several
differences. Which reflects the actual DAC081C085CIMMX/NOPB device dimensions?
Q4 When you purchase DAC08C81CI in MSOP Pb-free package, is ordering code “DAC081C085CIMMX/NOPB”
Q5 Can you provide recommended soldering pad dimensions of VSSOP package?
Q6. When DAC081C085CIMMX/NOPB datasheet is revised from NS version to Newest TI version, beside package
Information, what items were changed?
Can you provide us the list of changes?